Chip Quik SMDLTLFP No Clean Solder Paste is engineered for precision electronic assembly and rework applications where low-temperature soldering is critical. Its advanced formulation with a melting point of 138°C ensures gentle thermal profiles to protect delicate components while delivering strong bonds and reliable electrical connections. The no clean design minimizes post-soldering clean-up tasks, making it ideal for both production lines and prototype work. Packaged in a convenient 5cc syringe dispensing 15g of solder paste, this product is optimized for T3 applications and offers consistent flow, excellent wettability, and a user-friendly dispensing system that enhances overall productivity.

Key Features

• Low melting point at 138°C for safe rework on heat-sensitive components
• No clean formulation reduces the need for post-soldering cleaning
• Optimized for T3 applications ensuring reliable solder joints
• Convenient 5cc syringe packaging provides easy application and precise dispensing
• Advanced alloy composition (Sn42/Bi57.6/Ag0.4) delivers consistent flow and metallurgical performance

Specifications

• Product: Chip Quik SMDLTLFP No Clean Solder Paste
• Alloy Composition: Sn42/Bi57.6/Ag0.4
• Melting Temperature: 138°C
• Packaging: 15g of solder paste in a 5cc syringe
• Application: T3, electronics assembly, and rework on sensitive components